Native name 海思半导体有限公司 Traded as HiSilicon Website www.hisilicon.com Headquarters Shenzhen | Type Subsidiary Products SoCs Founded 2004 | |
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Industry Fabless semiconductors, Semiconductors, Integrated circuit design Parent organizations Huawei, Huawei Investment & Holding Co., Ltd. | ||
Hisilicon all set to be a part of the make in india campaign
HiSilicon (Chinese: 海思; pinyin: Hǎisī) is a Chinese fabless semiconductor company based in Shenzhen, Guangdong and fully owned by Huawei.
Contents
- Hisilicon all set to be a part of the make in india campaign
- Hisilicon
- K3V2
- K3V2E
- Kirin 620
- Kirin 920 925 and 928
- Kirin 930 and 935
- Kirin 950 and 955
- Kirin 960
- Similar platforms
- References
HiSilicon purchased licenses from ARM Holdings for at least ARM Cortex-A9 MPCore, ARM Cortex-M3, ARM Cortex-A7 MPCore, ARM Cortex-A15 MPCore, ARM Cortex-A53, ARM Cortex-A57 and also for their Mali graphics cores.
HiSilicon also purchased licenses from Vivante Corporation for their GC4000 graphics core.
HiSilicon is reputed to be the largest domestic designer of integrated circuits in China.
Hisilicon
K3V2
The first well known product of HiSilicon is the K3V2 used in Huawei Ascend D Quad XL (U9510) smartphones and Huawei MediaPad 10 FHD7 tablets. This chipset is based on the ARM Cortex-A9 MPCore fabbed at 40 nm and uses a 16 core Vivante GC4000 GPU. The SoC support LPDDR2-1066, but actual products are found with LPDDR-900 instead for lower power consumption.
K3V2E
This is a revised version of K3V2 SoC with improved support of Intel baseband. The SoC support LPDDR2-1066, but actual products are found with LPDDR-900 instead for lower power consumption.
Kirin 620
• supports - USB 2.0 / 13 MP / 1080p video encode
Kirin 920, 925 and 928
• The Kirin 920 SoC also contains an image processor that supports up to 32 megapixel
Kirin 930 and 935
• supports - SD 3.0 (UHS-I) / eMMC 4.51 / Dual-band a/b/g/n Wi-Fi / Bluetooth 4.0 Low Energy / USB 2.0 / 32 MP ISP / 1080p video encode
Kirin 950 and 955
• supports - SD 4.1 (UHS-II) / UFS 2.0 / eMMC 5.1 / MU-MIMO 802.11ac Wi-Fi / Bluetooth 4.2 Smart / USB 3.0 / NFS / Dual ISP (42 MP) / Native 10-bit 4K video encode / i5 coprocessor / Tensilica HiFi 4 DSP