Native name サムコ株式会社 Website www.samco.co.jp Founded 1 September 1979 | Type Public company Founder Osamu Tsuji | |
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Products Reactive-ion etching (RIE) systems
Inductively coupled plasma (ICP) etching systems
Deep reactive-ion etching (DRIE) systems
Plasma-enhanced chemical vapor deposition (PECVD) systems
Liquid Source Chemical Vapor Deposition (LSCVD) systems
Plasma cleaning systems
UV-Ozone Cleaning Systems Stock price 6387 (TYO) JP¥ 965 +12.00 (+1.26%)24 Mar, 3:00 PM GMT+9 - Disclaimer Headquarters Fushimi-ku, Kyoto, Kyoto Prefecture, Japan | ||
Samco field lift
SAMCO Inc.（サムコ株式会社） is a Japanese company that manufactures and sells semiconductor process equipment for the fabrication of electronic components as well as other micro and nano-scale devices. The company is headquartered in Kyoto, Japan, and its product line can be divided into three categories: 1. Plasma etching systems (RIE, ICP, DRIE) 2. Plasma deposition systems (PECVD and LS-CVD®) 3. Surface treatment systems (plasma cleaners, UV-Ozone cleaners). On May 30, 2001, SAMCO Inc. made its IPO on the JASDAQ stock exchange. On July 24, 2013, SAMCO Inc.’s public listing was accepted into the second section of the Tokyo Stock Exchange (Japan’s largest stock exchange by volume).
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Introducing samco appraisal management company
Company Background
SAMCO Inc. was established in 1979 by its President and CEO, Osamu Tsuji, in a private garage in the Fushimi ward of Kyoto city. Initially called “SAMCO International, Inc.”, the company consisted of two engineers who developed a plasma CVD system for the deposition of amorphous silicon thin films used in solar cells. The name “SAMCO” is actually an acronym for “Semiconductor and Materials Company” and was chosen by Mr. Tsuji with a vision of making a breakthrough in semiconductor and materials research. By October 2012, SAMCO sales had accumulated to 3,000 units of semiconductor process equipment. 70% of SAMCO’s revenue comes from the fields of optoelectronics (high-luminance LED and laser applications) and electronic components (power device and SAW device applications). The company is now beginning to focus its sales efforts towards MEMS applications as well as GaN and SiC based power device applications.