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List of integrated circuit packaging types

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List of integrated circuit packaging types

Integrated circuits are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage. A very large number of different types of package exist. Some package types have standardized dimensions and tolerances, and are registered with trade industry associations such as JEDEC and Pro Electron. Other types are proprietary designations that may be made by only one or two manufacturers. Integrated circuit packaging is the last assembly process before testing and shipping devices to customers.

Contents

Occasionally specially-processed integrated circuit dies are prepared for direct connections to a substrate without an intermediate header or carrier. In flip chip systems the IC is connected by solder bumps to a substrate. In beam-lead technology, the metallized pads that would be used for wire bonding connections in a conventional chip are thickened and extended to allow external connections to the circuit. Assemblies using "bare" chips have additional packaging or filling with epoxy to protect the devices from moisture.

Through-hole packages

Through hole technology uses holes drilled through the PCB for mounting the components. The component has leads that are soldered to pads on the PCB to electrically and mechanically connect them to the PCB.

Chip carrier

A chip carrier is a rectangular package with contacts on all four edges. Leaded chip carriers have metal leads wrapped around the edge of the package, in the shape of a letter J. Leadless chip carriers have metal pads on the edges. Chip carrier packages may be made of ceramic or plastic and are usually secured to a printed circuit board by soldering, though sockets can be used for testing.

Ball grid array

Ball Grid Array BGA uses the underside of the package to place pads with balls of solder in grid pattern as connections to PCB.

Transistor, diode, small pin count IC packages

  • MELF: Metal Electrode Leadless Face (usually for resistors and diodes)
  • SOD: Small Outline Diode.
  • SOT: Small-outline transistor (also SOT-23, SOT-223, SOT-323).
  • TO-XX: wide range of small pin count packages often used for discrete parts like transistors or diodes.
  • TO-3: Panel mount with leads
  • TO-5: metal can package with radial leads
  • TO-18: metal can package with radial leads
  • TO-39
  • TO-46
  • TO-66: Similar shape to the TO-3 but smaller
  • TO-92: plastic encapsulated package with three leads
  • TO-99
  • TO-100
  • TO-126: plastic encapsulated package with three leads and a hole for mounting on a heat sink
  • TO-220: through-hole plastic package with a (usually) metal heat sink tab and three leads
  • TO-226
  • TO-247: plastic encapsulated package with three leads and a hole for mounting on a heat sink
  • TO-251: also called IPAK: SMT package similar to the DPAK but with longer leads for SMT or TH mounting
  • TO-252: (also called SOT428, DPAK): SMT package similar to the DPAK but smaller
  • TO-262: also called I2PAK: SMT package similar to the D2PAK but with longer leads for SMT or TH mounting
  • TO-263: also called D2PAK: SMT package similar to the TO-220 without the extended tab and mounting hole
  • TO-274: also called Super-247: SMT package similar to the TO-247 without the mounting hole

    • Package dimensions

    All measurements below are given in mm. To convert mm to mils, divide mm by 0.0254 (i.e., 2.54 mm / 0.0254 = 100 mil).

  • C - Clearance between package body and PCB.
  • H - Height of package from pin tip to top of package.
  • T - Thickness of pin.
  • L - Length of package body only.
  • LW - Pin width.
  • LL - Pin length from package to pin tip.
  • P - Pin pitch (distance between conductors to the PCB).
  • WB - Width of the package body only.
  • WL - Length from pin tip to pin tip on the opposite side.

    • Multi-chip packages

    Occasionally people put several chips of silicon in a single package. A variety of techniques for interconnecting several chips within a single package have been proposed and researched:

  • SiP (system in package)
  • PoP (package on package)
  • 3D-SICs, Monolithic 3D ICs, and other three-dimensional integrated circuit
  • WSI (wafer-scale integration)
  • proximity communication

    • References

    List of integrated circuit packaging types Wikipedia
    (Text) CC BY-SA


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