Rahul Sharma (Editor)

List of Intel Xeon microprocessors

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"Drake" (250 nm)

  • All models support: MMX

    • "Tanner" (250 nm)

  • Based on P6 microarchitecture
  • All models support: MMX, SSE
  • All models support quad-processor configurations
  • Die size: 123 mm²
  • Steppings: B0, C0

    • "Cascades" (180 nm)

  • All models support: MMX, SSE
  • Only Xeon 700 and 900 are capable of quad processor configurations

    • "Foster" (180 nm)

  • Based on NetBurst microarchitecture
  • All models support: MMX, SSE, SSE2

    • "Prestonia" (130 nm)

  • Based on NetBurst microarchitecture
  • All models support: MMX, SSE, SSE2, Hyper-Threading

    • "Gallatin" (130 nm)

  • Based on NetBurst microarchitecture
  • All models support: MMX, SSE, SSE2, Hyper-Threading

    • "Nocona" (90 nm)

  • Based on NetBurst microarchitecture
  • All models support: MMX, SSE, SSE2, SSE3, Hyper-Threading, Intel 64
  • Steppings: D0, E0, G1

    • "Irwindale" (90 nm)

  • Based on NetBurst microarchitecture
  • All models support: MMX, SSE, SSE2, SSE3, EIST, XD bit (an NX bit implementation) and Intel 64.
  • E processors do not support Hyper-Threading.
  • Steppings: N0, R0

    • "Paxville DP" (90 nm)

  • Based on NetBurst microarchitecture
  • All models support: MMX, SSE, SSE2, SSE3, Hyper-Threading, Intel 64, XD bit (an NX bit implementation)
  • Steppings: A0

    • "Dempsey" (65 nm)

  • Based on NetBurst microarchitecture
  • All models support: MMX, SSE, SSE2, SSE3, Hyper-Threading, Intel 64, XD bit (an NX bit implementation), Intel VT-x
  • All models support dual-processor configurations
  • Die size: 2 × 81 mm²
  • Demand Based Switching (Intel's Server EIST): Supported by: All except 5060, 5063.
  • Steppings: C1

    • "Foster MP" (180 nm)

  • Based on NetBurst microarchitecture
  • All models support: MMX, SSE, SSE2, Hyper-Threading

    • "Gallatin" (130 nm)

  • Based on NetBurst microarchitecture
  • All models support: MMX, SSE, SSE2, Hyper-Threading

    • "Cranford" (90 nm)

  • Based on NetBurst microarchitecture
  • All models support: MMX, SSE, SSE2, SSE3, Hyper-Threading, Intel 64, XD bit (an NX bit implementation)
  • Steppings: A0, B0

    • "Potomac" (90 nm)

  • Based on NetBurst microarchitecture
  • All models support: MMX, SSE, SSE2, SSE3, Hyper-Threading, Intel 64, XD bit (an NX bit implementation)
  • Steppings: C0

    • "Paxville MP" (90 nm)

  • Based on NetBurst microarchitecture
  • All models support: MMX, SSE, SSE2, SSE3, Hyper-Threading, Intel 64, XD bit (an NX bit implementation), Intel VT-x
  • Demand Based Switching (Intel's Server EIST): All except 7030.
  • Steppings: A0

    • "Tulsa" (65 nm)

  • Based on NetBurst microarchitecture
  • All models support: MMX, SSE, SSE2, SSE3, Hyper-Threading, Intel 64, XD bit (an NX bit implementation), Intel VT-x
  • All models support quad-processor and octo-processor configurations
  • Demand Based Switching (Intel's Server EIST): Supported by: All except 7110M/N & 7120M/N.
  • Die size: 435 mm²
  • Steppings: B0

    • "Sossaman" (65 nm)

  • Based on Enhanced Pentium M microarchitecture
  • All models support: MMX, SSE, SSE2, SSE3, Demand Based Switching (Intel's Server EIST) , XD bit (an NX bit implementation), Intel VT-x
  • All models support dual-processor configurations
  • Die size: 90.3 mm²
  • Steppings: C0, D0

    • "Allendale" (65 nm)

  • Based on Core microarchitecture
  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, XD bit (an NX bit implementation), Intel VT-x
  • All models support uni-processor configurations
  • Die size: 111 mm²
  • Steppings: L2

    • "Conroe" (65 nm)

  • Based on Core microarchitecture
  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, XD bit (an NX bit implementation), Intel VT-x
  • All models support uni-processor configurations
  • Die size: 143 mm²
  • Steppings: B2, G0

    • "Woodcrest" (65 nm)

  • Based on Core microarchitecture
  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, EIST, XD bit (an NX bit implementation), Intel VT-x
  • All models support dual-processor configurations
  • Die size: 143 mm²
  • Steppings: B2, G0
  • For processors with G0 stepping Vmin = 0.85 V

    • "Wolfdale-CL" (45 nm)

  • Based on Penryn microarchitecture
  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x
  • Models support only uni-processor configurations
  • Die size: 107 mm²
  • Steppings: C0, E0

    • "Wolfdale" (45 nm)

  • Based on Penryn microarchitecture
  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Intel 64, XD bit (an NX bit implementation), Intel VT-x
  • All model support EIST
  • All models support only single-processor configurations
  • Die size: 107 mm²
  • Steppings: C0, E0

    • "Wolfdale-DP" (45 nm)

  • Based on Penryn microarchitecture
  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Intel 64, XD bit (an NX bit implementation), Intel VT-x
  • All model support EIST except L5238, L5240.
  • E5205, L5238, L5240, X5260, X5270, X5272 support Demand-Based Switching.
  • All models support dual-processor configurations
  • Die size: 107 mm²
  • Steppings: C0, E0

    • "Kentsfield" (65 nm)

  • Based on Core microarchitecture
  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x
  • All models support uni-processor configurations
  • Die size: 2 × 143 mm²
  • Steppings: B3, G0

    • "Yorkfield-6M" (45 nm)

  • Based on Penryn microarchitecture
  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Enhanced Halt State (C1E), Intel 64, XD bit (an NX bit implementation), Intel VT-x
  • All models support uni-processor configurations
  • Die size: M1: 2 × 107 mm², R0: 2 × 81 mm²
  • Steppings: M1, R0

    • "Yorkfield" (45 nm)

  • Based on Penryn microarchitecture
  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Enhanced Halt State (C1E), Intel 64, XD bit (an NX bit implementation), Intel VT-x
  • All models support uni-processor configurations
  • Die size: 2 × 107 mm²
  • Steppings: C1, E0

    • "Yorkfield-CL" (45 nm)

  • Based on Penryn microarchitecture
  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Enhanced Halt State (C1E), Intel 64, XD bit (an NX bit implementation), Intel VT-x
  • All models support uni-processor configurations
  • Die size: 2 × 107 mm²
  • Steppings: C1, E0

    • "Clovertown" (65 nm)

  • Based on Core microarchitecture
  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, XD bit (an NX bit implementation), Intel VT-x
  • EIST support all except E5310, E5335.
  • Intel Demand-Based Switching support E5320, E5345, L5318, X5355, X5365.
  • All models support dual-processor configurations
  • Steppings: B3, G0
  • Die size: 2 × 143 mm²

    • E5330, E5340 and E5350 is not listed on but it is mentioned on. In August 2007, E5330 is widely available. In June 2007, E5340 Engineering Samples were available on eBay.

    Contents

    "Harpertown" (45 nm)

  • Based on Penryn microarchitecture
  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Intel 64, XD bit (an NX bit implementation), Intel VT-x, Demand-Based Switching except E5405, L5408; EIST except E5405
  • All models support dual-processor configurations
  • Die size: 2 × 107 mm²
  • Steppings: C0, E0

    • "Tigerton" (65 nm)

  • Based on Core microarchitecture
  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x
  • All models support quad-processor configurations
  • Die size: 2 × 143 mm²
  • Steppings: G0

    • "Dunnington" (45 nm)

  • Based on Penryn microarchitecture
  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Demand-Based Switching, Intel 64, XD bit (an NX bit implementation), Intel VT-x
  • E7440, E7450, X7460 support EIST.
  • All models support quad-processor configurations
  • Transistors: 1.9 billion
  • Die size: 503 mm²
  • Steppings: A1

    • "Clarkdale" (MCP, 32 nm)

  • Based on Westmere microarchitecture
  • Uni-processor only
  • L3406 supports Hyper-Threading, Turbo Boost
  • All models support: MMX, XD bit, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, x64, SpeedStep, Smart Cache, VT-x, EPT, VT-d, TXT, ECC
  • Contains 45 nm "Ironlake" GPU.
  • Die size: 81 mm² (CPU Component)
  • Steppings: C2

    • "Lynnfield" (45 nm)

  • Based on Nehalem microarchitecture
  • Uni-processor only
  • All models except X3430 support Hyper-Threading
  • All models support: MMX, XD bit, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, x64, SpeedStep, Turbo Boost, Smart Cache, VT-x, EPT, VT-d, TXT, ECC
  • Die size: 296 mm²
  • Steppings: B1

    • "Bloomfield" (45 nm)

  • Based on Nehalem microarchitecture
  • Uni-processor only
  • Quad Core models support: Hyper-Threading, Turbo Boost
  • All models support: MMX, XD bit, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, x64, SpeedStep, Smart Cache, VT-x, EPT, ECC
  • Die size: 263 mm²
  • Steppings: D0

    • "Jasper Forest" (45 nm)

  • Based on Nehalem microarchitecture
  • Uni-processor only
  • LC3528 supports: Hyper-Threading, Turbo Boost
  • All models support: MMX, XD bit, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, x64, SpeedStep, Smart Cache, VT-x, EPT, VT-d, ECC
  • Die size: 263 mm²
  • Steppings: B0

    • "Gulftown" (32 nm)

  • Based on Westmere microarchitecture
  • Uniprocessor-only systems
  • All models support: Hyper-Threading
  • All models support: MMX, XD bit, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, x64, AES-NI, SpeedStep, Turbo Boost, Smart Cache, VT-x, EPT, VT-d, TXT, ECC
  • Die size: 240 mm²
  • Steppings: B1

    • "Gainestown" (45 nm)

  • Based on Nehalem microarchitecture
  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Demand-Based Switching (Intel's Server EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel EPT, Intel VT-d, Intel VT-c, Intel x8 SDDC
  • All models support: Hyper-Threading, Turbo Boost except E5502, E5503, E5504, E5506, L5506, E5507
  • All models support dual-processor configurations
  • Die size: 263 mm²
  • Steppings: D0

    • "Jasper Forest" (45 nm)

  • Based on Nehalem microarchitecture
  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Demand-Based Switching (Intel's Server EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel EPT, Intel VT-d, Intel VT-c, Intel x8 SDDC
  • EC5549, LC5528, and LC5518 support: Hyper-Threading, Turbo Boost
  • Die size: 263 mm²
  • Steppings: B0

    • "Westmere-EP" (32 nm) Efficient Performance

  • Based on Westmere microarchitecture
  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), TXT, Intel VT-x, Intel EPT, Intel VT-d, Intel VT-c, Intel x8 SDDC, AES-NI, Smart Cache, Hyper-Threading, Turbo Boost except E5603, E5606, E5607, L5609
  • Dual-socket configurations supported
  • Die size: 240 mm²
  • Steppings: B1

    • "Beckton" (45 nm)

  • Based on Nehalem microarchitecture
  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), TXT, Intel VT-x, Intel EPT, Intel VT-d, Intel VT-c, Intel x8 SDDC, Turbo Boost, Smart Cache, Hyper-Threading except X7542
  • 65xx models support single- and dual-processor configurations, while 75xx models support up to 8-processor configurations
  • Transistors: 2.3 billion
  • Die size: 684 mm²
  • Steppings: D0

    • "Westmere-EX" (32 nm) Expandable

  • Based on Westmere microarchitecture.
  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), TXT, Intel VT-x, Intel EPT, Intel VT-d, Intel VT-c, Intel DDDC, Hyper-threading (except E7-8837), Turbo Boost, AES-NI, Smart Cache.
  • 28xx models support single- and dual-processor configurations, 48xx models support up to four-processor configurations, 88xx models support up to eight-processor configurations.
  • Transistors: 2.6 billion
  • Die size: 513 mm²
  • Steppings: A2

    • "Gladden" (32 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), TXT, Intel VT-x, Intel EPT, Intel VT-d, Hyper-threading, AES-NI.
  • All models support uni-processor configurations only.
  • Die size:216 mm²
  • Steppings: D2

    • "Sandy Bridge" (32 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), TXT, Intel VT-x, Intel EPT, Intel VT-d, Hyper-threading (except E3-1220 and E3-1225), Turbo Boost, AES-NI, Smart Cache.
  • All models support uni-processor configurations only.
  • Intel HD Graphics P3000 uses drivers that are optimized and certified for professional applications, similar to Nvidia Quadro and AMD FirePro products.
  • Die size: D2: 216 mm², Q0: 131 mm²
  • Steppings: D2, Q0

    • "Sandy Bridge-EN" (32 nm) Entry

  • Based on Sandy Bridge-E CPU.
  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), TXT, Intel VT-x, Intel EPT, Intel VT-d, Intel VT-c, Intel x8 SDDC, Hyper-threading (except E5-2403 and E5-2407), Turbo Boost (except E5-1428L, E5-2403 and E5-2407), AES-NI, Smart Cache.

    • "Sandy Bridge-EP" (32 nm) Efficient Performance

  • Based on Sandy Bridge microarchitecture.
  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), TXT, Intel VT-x, Intel EPT, Intel VT-d, Intel VT-c, Intel x8 SDDC, Hyper-threading(except E5-1603, E5-1607, E5-2603, E5-2609 and E5-4617), Turbo Boost (except E5-1603, E5-1607, E5-2603, E5-2609, E5-4603 and E5-4607), AES-NI, Smart Cache.

    • "Gladden" (22 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), TXT, Intel VT-x, Intel EPT, Intel VT-d, Hyper-threading, AES-NI.
  • All models support uni-processor configurations only.
  • Die size:160 mm²
  • Steppings: E1

    • "Ivy Bridge" (22 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, F16C, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), TXT, Intel VT-x, Intel EPT, Intel VT-d, Hyper-threading (except E3-1220 v2 and E3-1225 v2), Turbo Boost, AES-NI, Smart Cache, ECC
  • Transistors: E1: 1.4 billion
  • Die size: E1: 160 mm²
  • All models support uni-processor configurations only.
  • Intel HD Graphics P4000 uses drivers that are optimized and certified for professional applications, similar to nVidia Quadro and AMD FirePro products.

    • "Ivy Bridge-EN" (22 nm) Entry

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, F16C, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), TXT, Intel VT-x, Intel EPT, Intel VT-d, Intel VT-c, Intel x8 SDDC, Hyper-threading (except E5-2403 v2 and E5-2407 v2), Turbo Boost (except E5-2403 v2, E5-2407 v2 and E5-2418L v2), AES-NI, Smart Cache.
  • Support for up to six DIMMs of DDR3 memory per CPU socket.

    • "Ivy Bridge-EP" (22 nm) Efficient Performance

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, F16C, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), TXT, Intel VT-x, Intel EPT, Intel VT-d, Intel VT-c, Intel x8 SDDC, Hyper-threading (except E5-1607 v2, E5-2603 v2, E5-2609 v2 and E5-4627 v2), Turbo Boost (except E5-1607 v2, E5-2603 v2, E5-2609 v2, E5-2618L v2, E5-4603 v2 and E5-4607 v2), AES-NI, Smart Cache.
  • Support for up to 12 DIMMs of DDR3 memory per CPU socket.

    • "Ivy Bridge-EX" (22 nm) Expandable

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, F16C, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), TXT, Intel VT-x, Intel EPT, Intel VT-d, Intel VT-c, Intel x8 SDDC, Hyper-threading (except E7-8857 v2), Turbo Boost (except E7-4809 v2), AES-NI, Smart Cache.
  • Support for up to 24 DIMMs of DDR3 memory per CPU socket.

    • "Haswell-WS" (22 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, F16C, BMI1 (Bit Manipulation Instructions1), BMI2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), TXT, Intel vPro, Intel VT-x, Intel VT-d, Hyper-threading (except E3-1220 v3, E3-1225 v3 and E3-1226 v3), Turbo Boost 2.0, AES-NI, Smart Cache, TSX, ECC, Intel x8 SDDC

    • "Haswell-EN" (22 nm) Entry

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, F16C, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), TXT, Intel VT-x, Intel EPT, Intel VT-d, Intel VT-c, Intel x8 SDDC, Hyper-threading, Turbo Boost (except E5-2408 v3 and E5-2418L v3), AES-NI, Smart Cache.
  • Support for up to six DIMMs of DDR3 memory per CPU socket.

    • "Haswell-EP" (22 nm) Efficient Performance

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, F16C, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Hyper-threading (except E5-1603 v3, E5-1607 v3, E5-2603 v3, E5-2609 v3, E5-2628 v3, E5-2663 v3, E5-2685 v3 and E5-4627 v3), Turbo Boost 2.0 (except E5-1603 v3, E5-1607 v3, E5-2603 v3, E5-2608L v3, E5-2609 v3 and E5-4610 v3), AES-NI, Smart Cache.
  • Transistors: Up to 8 cores: 2.60 billion, Up to 12 cores: 3.84 billion, Up to 18 cores: 5.69 billion
  • Die size: Up to 8 cores: 354 mm², Up to 12 cores: 492 mm², Up to 18 cores: 662 mm²
  • Support for up to 12 DIMMs of DDR4 memory per CPU socket (E5-2629 v3, 2649 v3 and 2669 v3 also support DDR3 memory).

    • "Haswell-EX" (22 nm) Expandable

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, F16C, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Hyper-threading, Turbo Boost 2.0 (except E7-4809 v3 and 4820 v3), AES-NI, Smart Cache.
  • Transistors: Up to 18 cores: 5.69 billion
  • Die size: Up to 18 cores: 662 mm²
  • Support for up to 24 DIMMs of DDR3 or DDR4 memory per CPU socket.

    • "Broadwell-DE" (14 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, F16C, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), TXT, Intel VT-x, Intel EPT, Intel VT-d, Hyper-threading, Turbo Boost (except D-1518, D-1529), AES-NI, Smart Cache, ECC memory.
  • SoC peripherals include 8 × USB (4 × 2.0, 4 × 3.0), 6 × SATA, 2 × Integrated 10 GbE LAN, UART, GPIO, and 32 lanes of PCI Express (8 × 2.0, 24 × 3.0), in ×16, ×8 and ×4 configurations.
  • Support for up to four DIMMs of DDR4 or DDR3L memory per CPU socket.

    • "Broadwell-H" (14 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, F16C, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), TXT, Intel VT-x, Intel EPT, Intel VT-d, Hyper-threading, Turbo Boost, AES-NI, Smart Cache, ECC memory.
  • Support for up to four DIMMs of DDR3L memory per CPU socket.

    • "Broadwell-EP" (14 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, F16C, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Hyper-threading (except E5-2603v4, 2609v4 and 4627v4), Turbo Boost 2.0 (except E5-1603v4, 1607v4, 2603v4, 2609v4 and 4610v4), AES-NI, Smart Cache.
  • Transistors: Up to 10 cores: 3.20 billion, Up to 15 cores: 4.70 billion, Up to 24 cores: 7.20 billion
  • Die size: Up to 10 cores: 246 mm², Up to 15 cores: 306 mm², Up to 24 cores: 456 mm²
  • Support for up to twelve DIMMs of DDR4 memory per CPU socket.

    • "Broadwell-EX" (14 nm)

  • All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, F16C, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Hyper-threading, Turbo Boost 2.0, AES-NI, Smart Cache.
  • Support for up to 12 DIMMs of DDR4 memory per CPU socket.

    • References

    List of Intel Xeon microprocessors Wikipedia
    (Text) CC BY-SA