Kalpana Kalpana (Editor)

IEEE Transactions on Advanced Packaging

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Covid-19
Language  English
Edited by  Ganesh Subbarayan
Former names  IEEE Transactions on Components and Packaging Technologies, IEEE Transactions on Electronics Packaging Manufacturing
Abbreviated title (ISO 4)  IEEE Trans. Adv. Packag.
Discipline  Multi-chip modules, wafer-scale integration
Publisher  IEEE Components, Packaging, and Manufacturing Technology Society

IEEE Transactions on Advanced Packaging was a quarterly peer-reviewed scientific journal published by the IEEE Components, Packaging & Manufacturing Technology Society and the IEEE Photonics Society. It covered research on the design, modeling, and applications of multi-chip modules and wafer-scale integration. It was established in 1999 and ceased publication in 2010. The last editor-in-chief was Ganesh Subbarayan (Purdue University). According to the Journal Citation Reports, the journal had a 2010 impact factor of 1.276.

References

IEEE Transactions on Advanced Packaging Wikipedia


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