Language English | Edited by Ganesh Subbarayan | |
Former names IEEE Transactions on Components and Packaging Technologies, IEEE Transactions on Electronics Packaging Manufacturing Abbreviated title (ISO 4) IEEE Trans. Adv. Packag. Publisher IEEE Components, Packaging, and Manufacturing Technology Society | ||
IEEE Transactions on Advanced Packaging was a quarterly peer-reviewed scientific journal published by the IEEE Components, Packaging & Manufacturing Technology Society and the IEEE Photonics Society. It covered research on the design, modeling, and applications of multi-chip modules and wafer-scale integration. It was established in 1999 and ceased publication in 2010. The last editor-in-chief was Ganesh Subbarayan (Purdue University). According to the Journal Citation Reports, the journal had a 2010 impact factor of 1.276.
References
IEEE Transactions on Advanced Packaging Wikipedia(Text) CC BY-SA