| English|| Ganesh Subbarayan|
| IEEE Transactions on Components and Packaging Technologies, IEEE Transactions on Electronics Packaging Manufacturing|
IEEE Trans. Adv. Packag.
Multi-chip modules, wafer-scale integration
IEEE Components, Packaging, and Manufacturing Technology Society
IEEE Transactions on Advanced Packaging Wikipedia
IEEE Transactions on Advanced Packaging was a quarterly peer-reviewed scientific journal published by the IEEE Components, Packaging & Manufacturing Technology Society and the IEEE Photonics Society. It covered research on the design, modeling, and applications of multi-chip modules and wafer-scale integration. It was established in 1999 and ceased publication in 2010. The last editor-in-chief was Ganesh Subbarayan (Purdue University). According to the Journal Citation Reports, the journal had a 2010 impact factor of 1.276.