Language English | Edited by Ganesh Subbarayan | |
Former names IEEE Transactions on Components and Packaging Technologies, IEEE Transactions on Electronics Packaging Manufacturing Abbreviated title (ISO 4) IEEE Trans. Adv. Packag. Discipline Multi-chip modules, wafer-scale integration Publisher IEEE Components, Packaging, and Manufacturing Technology Society | ||
IEEE Transactions on Advanced Packaging was a quarterly peer-reviewed scientific journal published by the IEEE Components, Packaging & Manufacturing Technology Society and the IEEE Photonics Society. It covered research on the design, modeling, and applications of multi-chip modules and wafer-scale integration. It was established in 1999 and ceased publication in 2010. The last editor-in-chief was Ganesh Subbarayan (Purdue University). According to the Journal Citation Reports, the journal had a 2010 impact factor of 1.276.
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IEEE Transactions on Advanced Packaging Wikipedia(Text) CC BY-SA