Wedge bonding is a kind of wire bonding which relies on the application of ultrasonic power and force to form bonds. It is a popular method and is commonly used in the semiconductor industry.
References
Wedge bonding Wikipedia(Text) CC BY-SA
Wedge bonding is a kind of wire bonding which relies on the application of ultrasonic power and force to form bonds. It is a popular method and is commonly used in the semiconductor industry.