Quilt packaging

Quilt Packaging (QP) is an integrated circuit packaging and chip-to-chip interconnect technology that incorporates conductive “nodules” fabricated on the sides of chips. These nodule structures function as extremely wide bandwidth, low-loss electrical I/O, with sub-micron mechanical chip-to-chip alignment. When utilized for electrical I/O, QP nodules have demonstrated around 2 dB of insertion loss across the entire bandwidth from 50 MHz to 220 GHz.