Hardmask

A hardmask is a material used in semiconductor processing as an etch mask instead of a polymer or other organic "soft" resist material. The idea is that polymers tend to be etched easily by oxygen, fluorine, chlorine or other reactive gases to the extent that a pattern defined using a polymeric mask is rapidly degraded during plasma etching. However, in 2017 a novel technique utilizing a soft/hard mask has been demonstrated, bringing the perks of easy removal of soft materials and the sturdiness of hard masks to prolonged plasma etching (DRIE).